1 / 3 www.asb.co.kr july 2009 p lerow tm ALE2500T2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure eq uipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability f actor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other component s necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 2300 2700 gain db 23 24 gain flatness db 0.9 1.0 noise figure db 0.85 0.90 output ip3 (1) dbm 39 42 s11/s22 (2) db - 15/ - 13 output p1db dbm 23 24 s witching time (3) m sec - supply current ma 200 220 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 29~31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured with two tones at an output power of 7 dbm/tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground ou t line drawing (unit: mm) s 21 = 24.9 db@2300 mhz = 23.1 db@2700 mhz nf of 0.85 db over frequency unconditionally stable single 5v sup ply high oip3@low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommen d that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) ALE2500T2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ.@t = 25 c, v s = 5 v, freq. = 2500 mhz, z o.sys = 50 ohm feature s description
2 / 3 www.asb.co.kr july 2009 p lerow tm ALE2500T2 internally matched lna module s - param e ters noise figure oip3 p1db 2300~2700 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr july 2009 p lerow tm ALE2500T2 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing th e ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performanc e . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the ale module. therefore, c1 & c2 capa citors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 c/s ec) + - ale out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs size 25x25mm (for ale - t series C 10x10mm) evaluation board layout
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